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Surface Mount Chip LEDs
Description
The MSL-1947HB3, a BLUE source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes GaN on Sapphire LED chip technology and water clear epoxy package.
MSL-1947HB3
Package Dimensions
Applications
l l l l
Small Size (Extra Thin) Industry Standard Footprint(0603) Compatible with IR Solder process Availalble in 8 mm Tape on 7"(178mm) Diameteer Reels
Features
l l l l
Recommended Solder Patterns
Push-Button Backlighting LCD Backlighting Symbol Backlighting Front Panel Indicator
NOTE: 1. All dimensions are in millimeter (inches) 2. Tolerance is 0.15mm (.006") unless otherwise specified.
Absolute Maximum Ratings
@ TA=25 C Parameter Peak Forward Current(1/10 Duty Cycle@1KHz ) DC Forward Current Power Dissipation Reverse Voltage Electrostatic Discharge Threshold (HBM) Note A Operating Temperature Range Storage Temperature Range
Note A : HBM(Human Body Model)
o
Symbol IFP IF PD VR EOT TOPR TSTG
Maximum Rating 100 30 125 5 300 -25 C to +80 C -30oC to +100oC
o o
Unit mA mA mW V V
Unity Opto Technology Co., Ltd.
04/02/2003
MSL-1947HB3
Optical-Electrical Characteristics
@ TA=25oC Item Luminous Intensity Forward Voltage Dominant Wavelength Threshould Voltage Reverse Voltage Reverse Current Dominant Wavelength
Relative Luminous Intensity
Conditions IF=10mA IF=20mA IF=20mA IF=10uA IR=10uA VR=5V IF=20mA
Symbol IV VF d Vth VR IR d
Min . 23 3.0 465 2.0 10.0 465
Typ . 468 -
Max . 3.5 470 2.6 50.0 475
Unit . mcd V nm V V A nm
Typical Optical-Electrical Characteristic Curves
Forward Current IF(mA)
1 30 25 20 15 10 5 0 0 1 2 3 4
0.5
0 380 450 520 590 660
Wavelength (nm) FIG.1 RELATIVE INTENSITY LUMINOUS VS. WAVELENGTH Forward Current IF (mA)
40 30 20 10 0 0 25 50 75 100
Forward Voltage (V) FIG.2 FORWARD CURRENT VS. FORWARD VOLTAGE Relative Luminous Intensity Normalized at IF=20mA
1.50 1.25 1.00 0.75 0.50 0.25 0.00 0 5 10 15 20 25 30
Ambient Temperature (oC) FIG.3 FORWARD CURRENT VS. AMBIENT TEMPERATURE Relative Luminous Intensity
10
Forward Current IF (mA) FIG.4 RELATIVE LUMINOUS INTENSITY VS. FORWARD CURRENT Relative Luminous Intensity
0o 10o 20o 30 40 1.0 0.9 0.8 0.5 0.3 0.1 0.2 0.4 0.6 50 60 70 80 90
1
0.1 0 25 50 75
Ambient Temperature ( C) FIG.5 LUMINOUS INTENSITY VS. AMBIENT TEMPERATURE
o
FIG.6 RADIATION DIAGRAM
Unity Opto Technology Co., Ltd.
04/02/2003
MSL-1947HB3
Sorting For Luminous Intensity And Dominant Wavelength
Forward Voltage Rank Markings VF (Volts) @IF = 5mA Min A B 2.70 2.80 Max 2.80 2.90
Luminous Intensity Iv(mcd) IF=10mA Min 23.00 25.00 Max 35.00 35.00
Dominant Wavelength d(nm) IF=20mA Min 465.0 465.0 Max 470.0 470.0
Remark
Unity Opto Technology Co., Ltd.
04/02/2003
MSL-1947HB3
GaN LED HANDLING PRECAUTION The blue LED is a device that is very sensitive to serge voltage produced when static electricity is discharged.Handling with sufficient care is needed to prevent damage to a chip or a drop in its reliability. Also, the same handling care is needed when applying voltage over the absolute maximum rating. (Be aware of serge voltage produced when you turn the on-off switch) How to prevent electrical charge and discharge during operation If the person who is electrically charged touches the part, there is a possibility of electric discharge toward the semiconductor device which may destroy the part, if the part is electrically charged inductively by the surroundings,or the part is electrically charged by friction and touches metal, the part may discharge static and cause damage. During your operations,please take these countermeasures written below. 1. Do not let material which is electrically chaged get close to the part. (Avoid contact with metal when the part is electrically charged) 2. Avoid any friction process with the part 3. Be sure to ground all manufacturing machines and measuring instruments if possible 4. Make an anti-static environment, such as placing electrically conductive mat (below 106 )or using anti-static equipment such as static blow Let the worker wear the anti-static wrist strap, (Electrical resistance of 250K-1M must be placed in series to avoid an electric shock.) Working Environment In case of semiconductor device, static occurs easily in dry condition . Especially the surface mount led should be kept in a dry environment to avoid moisture absorbency .But a relative humidity of 50% or more is recommended for the process after the soldering . Static level should be kept under 300V at your working area.
Unity Opto Technology Co., Ltd.
04/02/2003
MSL-1947HB3
RECOMMENDED SOLDERING CONDITION
Reflow Soldering.
Temperature-Profile
Temp 2.5~5oC / sec.
o
240oC Max. 5sec. Max. 40sec. Max. Above 200oC
2.5~5 C / sec.
Pre-heating 120~150oC
120sec. Max.
Time
Unity Opto Technology Co., Ltd.
04/02/2003
MSL-1947HB3
Recommended Soldering Conditions
1.Reflow Soldering (1).The Fig. 1 temperature profile shall be at the surface of LED resin. (2).Number of reflow process shall be less than 2 times. If second reflow process would be performed,intervals between first and second process shall be as short as possible to prevent absorption of moisture to resin of LED Cooling process to nomal temp,shall be required between first and second refiow process (3).Temp,fluctuation to LED at pre-heat process shall be minimized.(Less than 6oC)
2.Dip Soldering (1).Preheat temp,for soldering:120-150oC ,60-120sec (2).Soldering temp:Temp of soldering pot 260 MAX.less than 5sec (3).Number of dip soldering process shall be less than 2 times and these process shall be performed in a row. Cooling process to normal temp, shall be required between first and second soldering process.
3.Other Caution (1).Manual soldering should be less than 280oC within 3 sec. (2).Heat or UV(or both)curing resin shall used for preliminary fixing. Curing condition or temp,:150oC MAX.less than 120sec (3).Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temp,after soldering (4).If manual soldering would be performed to repair LED by tweezers, mechanical force to resin should not be given
Unity Opto Technology Co., Ltd.
04/02/2003
MSL-1947HB3
Tape Dimensions
Pocessive direction
1.50.1 0.059
4.00.1 0.158
Polarity 0.754 0.03
0.254 0.01
0.9 0.035 4.00.1 0.158 Units: mm / inch
2.00.05 0.079
REEL Dimensions
13.50.2 600.5
9.00.1 12.00.15
1782
Units: mm / inch
Unity Opto Technology Co., Ltd.
04/02/2003
1.75 0.069 3.50.05 0.138 8.00.3 0.315
1.750.1 0.069
MSL-1947HB3
Packaging Product lable:
Loaded quantity per reel : 4000 pcs / reel
CUSTOMER: CUSTOMER P/N: DEVICE TYPE: BIN: LOT NO: Q'TY: DATE:
STORAGE PERIOD: Damp-proofbag un-opened: 6 month max. Temperature: 5 to 30oC; humidity:70%RH, max; 6 month max. STORAGE PRECAUTIONS: After open the laminate bag the lamps should be storage in the follow condition: Temperature: 5 to 30oC; humidity:70%RH, max; storage time: 72hrs max Baking condition: If backing is necessary, we recommended the backing condition is 60+/- 5oC 10hours
Packing Box Product lable:
Loaded quantity per box : 20,000 pcs / box
CUSTOMER: CUSTOMER P/N: DEVICE TYPE: BIN: LOT NO: Q'TY: DATE:
Unity Opto Technology Co., Ltd.
04/02/2003
MSL-1947HB3
Reel Packing
Direction of take out
Items Cover Leader Tape Carrier Tape Traiier Empty Pockets
Specifications Cover tape shall be longer than 200 mm without carrier tape There will be more than 10 empties There will be more than 15 empties There will be a maximum of 3 empty component pockets
Remarks The end of the tape shall be adhered to tape The orientation of tape is as shown
The end of the tape is inserted into a slit of the hub The maximum connecting pockets in the middle of carriertape
Unity Opto Technology Co., Ltd.
04/02/2003

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